1. 2. 3. material content data sheet sales product name ipd90n06s4-05 issued 29. august 2013 ma# MA000484882 package pg-to252-3-11 weight* 392.01 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 3.393 0.87 0.87 8656 8656 leadframe non noble metal iron 7439-89-6 0.140 0.04 357 inorganic material phosphorus 7723-14-0 0.042 0.01 107 non noble metal copper 7440-50-8 139.706 35.63 35.68 356382 356846 wire non noble metal aluminium 7429-90-5 3.970 1.01 1.01 10128 10128 encapsulation organic material carbon black 1333-86-4 1.434 0.37 3657 plastics epoxy resin - 25.088 6.40 63999 inorganic material silicondioxide 60676-86-0 116.840 29.81 36.58 298053 365709 leadfinish non noble metal tin 7440-31-5 3.740 0.95 0.95 9541 9541 plating non noble metal nickel 7440-02-0 0.091 0.02 232 inorganic material phosphorus 7723-14-0 0.000 0.00 0.02 1 233 solder noble metal silver 7440-22-4 0.074 0.02 188 non noble metal tin 7440-31-5 0.059 0.02 151 non noble metal lead 7439-92-1 2.822 0.72 0.76 7200 7539 heatspreader inorganic material phosphorus 7723-14-0 0.028 0.01 72 non noble metal iron 7439-89-6 0.095 0.02 241 non noble metal copper 7440-50-8 94.488 24.10 24.13 241035 241348 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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